Semikron Danfoss logo

23930350M05

SKiM609GAR12E4-M05

SKIM 93, HPTP

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandGermany
Stromstärke (A)600 A
Spannung1200 V
TopologieChopper/Booster
ProduktlinieSKiM 93
GehäuseSKIM 93
Abmessungen (LxBxH)160x150x35
TechnologieIGBT
Chip TechnologieIGBT 4 (Trench)
EigenschaftenIGBT 4 Trench Gate TechnologySolderless sinter technologyV<sub>CE(sat)</sub> with positive temperature coefficientLow inductance caseInsulated by Al<sub>2</sub>O<sub>3</sub> DBC (Direct Bonded Copper) ceramic substratePressure contact technology for thermal contactsSpring contact system to attach driver PCB to the control terminalsHigh short circuit capability, self limiting to 6 x I<sub>C</sub>Integrated temperature sensor
Typische AnwendungsgebieteAutomotive inverterHigh reliability AC inverter windHigh reliability AC inverter drives

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht1.2 Kilogramm
Nettogewicht1.1 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteHPTP
Varianten BeschreibungThe SKiM609GAR12E4-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/skim609gar12e4-m01-23930350m01">SKiM609GAR12E4-M01</a><a href="/products/p/skim609gar12e4-m05-23930350m05">SKiM609GAR12E4-M05</a>