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Semikron Danfoss Standard Photo MiniSKiiP II 1

25230770M25

SKiiP16NEL16V1-M25

MiniSKiiP II 1, Standard lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandChinaGermany
Stromstärke (A)50 A
Spannung650 V
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 1
Abmessungen (LxBxH)42x40x16
TechnologieIGBT
EigenschaftenRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532
Stoßstrom (A)75 A

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.046 Kilogramm
Nettogewicht0.036 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteStandard lid and HPTP
Varianten BeschreibungThe SKiiP16NEL16V1-M25 is a 650 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/skiip16nel16v1-m20-25230770m20">SKiiP16NEL16V1-M20</a><a href="/products/p/skiip16nel16v1-m01-25230770m01">SKiiP16NEL16V1-M01</a><a href="/products/p/skiip16nel16v1-m05-25230770m05">SKiiP16NEL16V1-M05</a><a href="/products/p/skiip16nel16v1-m21-25230770m21">SKiiP16NEL16V1-M21</a><a href="/products/p/skiip16nel16v1-m25-25230770m25">SKiiP16NEL16V1-M25</a>