25232760M15
SKiiP 38AC176V2-M15
MiniSKiiP II 3, Slim lid and HPTP
25232760M15
Produktdaten
Eigenschaften | Wert |
|---|---|
| Abmessungen (LxBxH) | 82x59x16 |
| Chip Technologie | IGBT 3 (Trench) |
| Eigenschaften | Trench IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532NTC T-Sensor |
| Gehäuse | MiniSKiiP II 3 |
| Herkunftsland | Germany |
| Produktlinie | MiniSKiiP |
| Produktstatus | In Production New |
| Spannung | 1700 V |
| Stromstärke (A) | 100 A |
| Technologie | IGBT |
| Topologie | Sixpack |
| Typ | MiniSKiiP II 3 |
| Variante | Slim lid and HPTP |
| Varianten Beschreibung | The SKiiP 38AC176V2-M15 is a 1700 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content. |
| Varianten Kurzbeschreibung | Module + Slim Pressure Lid + High Performance Thermal Paste (HPTP) |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.1 Kilogramm |
| Nettogewicht | 0.082 Kilogramm |
| Proposition 65 | Cancer and Reproductive Harm |