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Semikron Danfoss Standard Photo MiniSKiiP II 3

25232760M15

SKiiP 38AC176V2-M15

MiniSKiiP II 3, Slim lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandGermany
Stromstärke (A)100 A
Spannung1700 V
TopologieSixpack
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 3
Abmessungen (LxBxH)82x59x16
TechnologieIGBT
Chip TechnologieIGBT 3 (Trench)
EigenschaftenTrench IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532NTC T-Sensor

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.1 Kilogramm
Nettogewicht0.082 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteSlim lid and HPTP
Varianten BeschreibungThe SKiiP 38AC176V2-M15 is a 1700 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Varianten KurzbeschreibungModule + Slim Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/de-de/products/p/skiip-38ac176v2-m00-25232760m00">SKiiP 38AC176V2-M00</a><a href="/de-de/products/p/skiip-38ac176v2-m05-25232760m05">SKiiP 38AC176V2-M05</a><a href="/de-de/products/p/skiip-38ac176v2-m15-25232760m15">SKiiP 38AC176V2-M15</a><a href="/de-de/products/p/skiip-38ac176v2-m20-25232760m20">SKiiP 38AC176V2-M20</a><a href="/de-de/products/p/skiip-38ac176v2-m21-25232760m21">SKiiP 38AC176V2-M21</a><a href="/de-de/products/p/skiip-38ac176v2-m25-25232760m25">SKiiP 38AC176V2-M25</a>