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24920850VM05

SK75GD06E3ETE2-M05

SEMITOP E2, HPTP

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production
HerkunftslandItaly
Stromstärke (A)75 A
Spannung650 V
TopologieSixpack
ProduktlinieSEMITOP
GehäuseSEMITOP E2
Abmessungen (LxBxH)63x57x12
TechnologieIGBT
Chip TechnologieIGBT 3 (Trench)
EigenschaftenOptimized design for superior thermal performanceLow inductive designPress-Fit contact technology650V Trench IGBT3 (E3)Robust and soft switching CAL HD diode technologyIntegrated NTC temperature sensorUL recognized file no. E 63 532
Typische AnwendungsgebieteMotor drivesServo drivesAir conditioningAuxiliary InvertersUPS

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.055 Kilogramm
Nettogewicht0.035 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteHPTP
Varianten BeschreibungThe SK75GD06E3ETE2-M05 is a 650 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/sk75gd06e3ete2-m05-24920850vm05">SK75GD06E3ETE2-M05</a><a href="/products/p/sk75gd06e3ete2-24920850">SK75GD06E3ETE2</a>