24920850VM05
SK75GD06E3ETE2-M05
SEMITOP E2, HPTP
24920850VM05
Produktdaten
Eigenschaften | Wert |
|---|---|
| Abmessungen (LxBxH) | 63x57x12 |
| Chip Technologie | IGBT 3 (Trench) |
| Eigenschaften | Optimized design for superior thermal performanceLow inductive designPress-Fit contact technology650V Trench IGBT3 (E3)Robust and soft switching CAL HD diode technologyIntegrated NTC temperature sensorUL recognized file no. E 63 532 |
| Gehäuse | SEMITOP E2 |
| Herkunftsland | Italy |
| Produktlinie | SEMITOP |
| Produktstatus | In Production |
| Spannung | 650 V |
| Stromstärke (A) | 75 A |
| Technologie | IGBT |
| Topologie | Sixpack |
| Typische Anwendungsgebiete | Motor drivesServo drivesAir conditioningAuxiliary InvertersUPS |
| Variante | HPTP |
| Varianten Beschreibung | The SK75GD06E3ETE2-M05 is a 650 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| Varianten Kurzbeschreibung | Module + High Performance Thermal Paste (HPTP) |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.055 Kilogramm |
| Nettogewicht | 0.035 Kilogramm |
| Proposition 65 | Cancer and Reproductive Harm |