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22894260VM05

SKM800GB12M7-M05

SEMITRANS 3, HPTP

产品规格

特性
值
产品状态In Production New
原产地Slovakia
电流800 A
电压1200 V
拓扑Half-Bridge
产品线SEMITRANS
外壳SEMITRANS 3
尺寸106x62x31
技术IGBT
芯片技术IGBT M7
FeaturesV<sub>CE(sat)</sub> with positive temperature coefficientHigh overload capabilityLow loss high density IGBT´sLarge clearance (10 mm) and creepage distances (20 mm)Insulated copper baseplate using DBC Technology (Direct Bonded Copper)UL recognized, file no. E63532
典型应用AC inverter drivesUPSSolar energyEnergy storage

一般规格

特性
值
毛重0.32 千克
净重0.31 千克

Variant information

特性
值
Variants<a href="/zh-cn/products/p/skm800gb12m7-m05-22894260vm05">SKM800GB12M7-M05</a><a href="/zh-cn/products/p/skm800gb12m7-m07-22894260vm07">SKM800GB12M7-M07</a><a href="/zh-cn/products/p/skm800gb12m7-22894260">SKM800GB12M7</a>
产品变体介绍The SKM800GB12M7-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
产品变体简要介绍Module + High Performance Thermal Paste (HPTP)
变体HPTP