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22894260VM05

SKM800GB12M7-M05

SEMITRANS 3, HPTP

产品规格

特性
产品状态In Production New
原产地Slovakia
电流800 A
电压1200 V
拓扑Half-Bridge
产品线SEMITRANS
外壳SEMITRANS 3
尺寸106x62x31
技术IGBT
芯片技术IGBT M7
特性V<sub>CE(sat)</sub> with positive temperature coefficientFast and soft switching inverse CAL7 diodesHigh overload capabilityLow loss high density IGBT´sLarge clearance (10 mm) and creepage distances (20 mm)Insulated copper baseplate using DBC Technology (Direct Bonded Copper)UL recognized, file no. E63532
典型应用AC inverter drivesUPSSolar energyEnergy storage
变体HPTP

一般规格

特性
毛重0.32 千克
净重0.31 千克

Variant information

特性
Variants<a href="/products/p/skm800gb12m7-m05-22894260vm05">SKM800GB12M7-M05</a><a href="/products/p/skm800gb12m7-m07-22894260vm07">SKM800GB12M7-M07</a>
产品变体介绍The SKM800GB12M7-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
产品变体简要介绍Module + High Performance Thermal Paste (HPTP)