Semikron Danfoss logo

25230770M25

SKiiP16NEL16V1-M25

MiniSKiiP II 1, Standard lid and HPTP

产品规格

特性
产品状态In Production New
原产地ChinaGermany
电流50 A
电压650 V
产品线MiniSKiiP
外壳MiniSKiiP II 1
尺寸42x40x16
技术IGBT
特性Robust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532
变体Standard lid and HPTP
浪涌电流75 A

一般规格

特性
毛重0.046 千克
净重0.036 千克
Proposition 65Cancer and Reproductive Harm

Variant information

特性
Variants<a href="/products/p/skiip16nel16v1-m20-25230770m20">SKiiP16NEL16V1-M20</a><a href="/products/p/skiip16nel16v1-m01-25230770m01">SKiiP16NEL16V1-M01</a><a href="/products/p/skiip16nel16v1-m05-25230770m05">SKiiP16NEL16V1-M05</a><a href="/products/p/skiip16nel16v1-m21-25230770m21">SKiiP16NEL16V1-M21</a><a href="/products/p/skiip16nel16v1-m25-25230770m25">SKiiP16NEL16V1-M25</a>
产品变体介绍The SKiiP16NEL16V1-M25 is a 650 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
产品变体简要介绍Module + Standard Pressure Lid + High Performance Thermal Paste (HPTP)