25241719M25
SKiiP 38GB17E4V1-M25
MiniSKiiP II 3, Standard lid and HPTP
25241719M25
产品规格
特性 | 值 |
|---|---|
| 产品变体介绍 | The SKiiP 38GB17E4V1-M25 is a 1700 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content. |
| 产品变体简要介绍 | Module + Standard Pressure Lid + High Performance Thermal Paste (HPTP) |
| 产品状态 | In Production New |
| 产品线 | MiniSKiiP |
| 原产地 | Germany |
| 变体 | Standard lid and HPTP |
| 型号 | MiniSKiiP II 3 |
| 外壳 | MiniSKiiP II 3 |
| 尺寸 | 82x59x16 |
| 技术 | IGBT |
| 拓扑 | Half-Bridge |
| 特性 | Trench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532NTC T-Sensor |
| 电压 | 1700 V |
| 电流 | 300 A |
| 芯片技术 | IGBT 3 (Trench) |
一般规格
特性 | 值 |
|---|---|
| 毛重 | 0.1 千克 |
| 净重 | 0.082 千克 |
| Proposition 65 | Cancer and Reproductive Harm |