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25240719M25

SKiiP 38GB07E3V1-M25

MiniSKiiP II 3, Standard lid and HPTP

产品规格

特性
产品状态In Production New
原产地Germany
电流300 A
电压650 V
拓扑Half-Bridge
产品线MiniSKiiP
外壳MiniSKiiP II 3
尺寸82x59x16
技术IGBT
芯片技术IGBT 3 (Trench)
特性650V Trench IGBTsRobust and soft diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532NTC T-Sensor
变体Standard lid and HPTP

一般规格

特性
毛重0.1 千克
净重0.082 千克
Proposition 65Cancer and Reproductive Harm

Variant information

特性
Variants<a href="/products/p/skiip-38gb07e3v1-m00-25240719m00">SKiiP 38GB07E3V1-M00</a><a href="/products/p/skiip-38gb07e3v1-m01-25240719m01">SKiiP 38GB07E3V1-M01</a><a href="/products/p/skiip-38gb07e3v1-m10-25240719m10">SKiiP 38GB07E3V1-M10</a><a href="/products/p/skiip-38gb07e3v1-m11-25240719m11">SKiiP 38GB07E3V1-M11</a><a href="/products/p/skiip-38gb07e3v1-m20-25240719m20">SKiiP 38GB07E3V1-M20</a><a href="/products/p/skiip-38gb07e3v1-m21-25240719m21">SKiiP 38GB07E3V1-M21</a><a href="/products/p/skiip-38gb07e3v1-m25-25240719m25">SKiiP 38GB07E3V1-M25</a>
产品变体介绍The SKiiP 38GB07E3V1-M25 is a 650 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
产品变体简要介绍Module + Standard Pressure Lid + High Performance Thermal Paste (HPTP)