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25232760M15

SKiiP 38AC176V2-M15

MiniSKiiP II 3, Slim lid and HPTP

产品规格

特性
产品状态In Production New
原产地Germany
电流100 A
电压1700 V
拓扑Sixpack
产品线MiniSKiiP
外壳MiniSKiiP II 3
尺寸82x59x16
技术IGBT
芯片技术IGBT 3 (Trench)
特性Trench IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532NTC T-Sensor
变体Slim lid and HPTP

一般规格

特性
毛重0.1 千克
净重0.082 千克
Proposition 65Cancer and Reproductive Harm

Variant information

特性
Variants<a href="/products/p/skiip-38ac176v2-m00-25232760m00">SKiiP 38AC176V2-M00</a><a href="/products/p/skiip-38ac176v2-m05-25232760m05">SKiiP 38AC176V2-M05</a><a href="/products/p/skiip-38ac176v2-m15-25232760m15">SKiiP 38AC176V2-M15</a><a href="/products/p/skiip-38ac176v2-m20-25232760m20">SKiiP 38AC176V2-M20</a><a href="/products/p/skiip-38ac176v2-m21-25232760m21">SKiiP 38AC176V2-M21</a><a href="/products/p/skiip-38ac176v2-m25-25232760m25">SKiiP 38AC176V2-M25</a>
产品变体介绍The SKiiP 38AC176V2-M15 is a 1700 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
产品变体简要介绍Module + Slim Pressure Lid + High Performance Thermal Paste (HPTP)