Semikron Danfoss logo

25241235M15

SKiiP 26GAL12T4V1-M15

MiniSKiiP II 2, Slim lid and HPTP

产品规格

特性
产品状态In Production New
原产地Germany
电流200 A
电压1200 V
拓扑Chopper/Booster
产品线MiniSKiiP
外壳MiniSKiiP II 2
尺寸59x52x16
技术IGBT
芯片技术IGBT 4 (Trench)
特性Trench 4 IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532NTC T-Sensor
变体Slim lid and HPTP

一般规格

特性
毛重0.06 千克
净重0.055 千克
Proposition 65Cancer and Reproductive Harm

Variant information

特性
Variants<a href="/products/p/skiip-26gal12t4v1-m00-25241235m00">SKiiP 26GAL12T4V1-M00</a><a href="/products/p/skiip-26gal12t4v1-m01-25241235m01">SKiiP 26GAL12T4V1-M01</a><a href="/products/p/skiip-26gal12t4v1-m15-25241235m15">SKiiP 26GAL12T4V1-M15</a><a href="/products/p/skiip-26gal12t4v1-m20-25241235m20">SKiiP 26GAL12T4V1-M20</a><a href="/products/p/skiip-26gal12t4v1-m25-25241235m25">SKiiP 26GAL12T4V1-M25</a>
产品变体介绍The SKiiP 26GAL12T4V1-M15 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
产品变体简要介绍Module + Slim Pressure Lid + High Performance Thermal Paste (HPTP)