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24922730VM05

SK30DGDL07E3ETE1-M05

SEMITOP E1, HPTP

产品规格

特性
产品状态In Production
原产地Italy
电流30 A
电压650 V
拓扑CIB
产品线SEMITOP
外壳SEMITOP E1
尺寸63x34x12
技术IGBT
芯片技术IGBT 3 (Trench)
特性Optimized design for superior thermal performanceLow inductive designPress-Fit contact technology650V Trench IGBT3 (E3)Robust and soft switching CAL4F diode technologyPEP rectifier diode technology for enhanced power and environmental robustnessIntegrated NTC temperature sensorUL recognized file no. E 63 532
典型应用Motor drivesAir conditioningAuxiliary Inverters

一般规格

特性
毛重0.022 千克
净重0.022 千克
Proposition 65Cancer and Reproductive Harm

Variant information

特性
Variants<a href="/products/p/sk30dgdl07e3ete1-m05-24922730vm05">SK30DGDL07E3ETE1-M05</a><a href="/products/p/sk30dgdl07e3ete1-m07-24922730vm07">SK30DGDL07E3ETE1-M07</a><a href="/products/p/sk30dgdl07e3ete1-24922730">SK30DGDL07E3ETE1</a>
产品变体介绍The SK30DGDL07E3ETE1-M05 is a 650 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
产品变体简要介绍Module + High Performance Thermal Paste (HPTP)
变体HPTP