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24923021VM05

SK25GD12F4ETp-M05

SEMITOP 3, HPTP

产品规格

特性
产品状态In Production New
原产地Italy
电流25 A
电压1200 V
拓扑Sixpack
产品线SEMITOP
外壳SEMITOP 3
尺寸31x55x12
技术IGBT
芯片技术IGBT 4 Fast (Trench)
特性One screw mounting moduleSolder free mounting with Press-Fit terminalsFully compatible with other SEMITOP<sup>®</sup> Press-Fit typesTrench4 IGBT technologyCAL4F technology FWDIntegrated NTC temperature sensorUL recognized, file no. E 63 532
典型应用Motor drivesServo drivesAir conditioningAuxiliary InvertersUPS
变体HPTP

一般规格

特性
毛重0.035 千克
净重0.026 千克
Proposition 65Cancer and Reproductive Harm

Variant information

特性
Variants<a href="/products/p/sk25gd12f4etp-m05-24923021vm05">SK25GD12F4ETp-M05</a>
产品变体介绍The SK25GD12F4ETp-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
产品变体简要介绍Module + High Performance Thermal Paste (HPTP)