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24923270VM05

SK25DGD12T7ETE1s-M05

SEMITOP E1 Solder, HPTP

产品规格

特性
产品变体介绍The SK25DGD12T7ETE1s-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
产品变体简要介绍Module + High Performance Thermal Paste (HPTP)
产品状态In Production New
产品线SEMITOP
典型应用Motor drivesAir conditioningAuxiliary Inverters
原产地Italy
变体HPTP
外壳SEMITOP E1 Solder
尺寸63x34x12
技术IGBT
拓扑CI
特性Optimized design for superior thermal performanceLow inductive designSolder contact technology1200V Generation 7 IGBT (T7)Robust and soft switching CAL4F diode technologyPEP rectifier diode technology for enhanced power and environmental robustnessIntegrated NTC temperature sensorUL recognized file no. E 63 532
电压1200 V
电流25 A
芯片技术IGBT T7

一般规格

特性
毛重0.022 千克
净重0.022 千克
Proposition 65Cancer and Reproductive Harm