24914740VM05
SK 30 GBB 066 T-M05
SEMITOP 3, HPTP
24914740VM05
产品规格
特性 | 值 |
|---|---|
| 产品状态 | In Production |
| 原产地 | Italy |
| 电流 | 30 A |
| 电压 | 600 V |
| 拓扑 | H-Bridge |
| 产品线 | SEMITOP |
| 外壳 | SEMITOP 3 |
| 尺寸 | 55x31x12 |
| 技术 | IGBT |
| 芯片技术 | IGBT 3 (Trench) |
| 特性 | Compact designOne scre mountingHeat transfer and isolation trough direct copper bonded aluminium oxide ceramic (DCB)Trench IGBT technologyCAL HD technology FWDIntegrated NTC temperature sensor |
| 典型应用 | Switching (not for linear use)InverterSwitched mode power suppliesUPS |
| 变体 | HPTP |
一般规格
特性 | 值 |
|---|---|
| 毛重 | 0.039 千克 |
| 净重 | 0.03 千克 |
| Proposition 65 | Cancer and Reproductive Harm |
Variant information
特性 | 值 |
|---|---|
| Variants | <a href="/products/p/sk-30-gbb-066-t-m01-24914740vm01">SK 30 GBB 066 T-M01</a><a href="/products/p/sk-30-gbb-066-t-m05-24914740vm05">SK 30 GBB 066 T-M05</a> |
| 产品变体介绍 | The SK 30 GBB 066 T-M05 is a 600 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| 产品变体简要介绍 | Module + High Performance Thermal Paste (HPTP) |