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24914740VM05

SK 30 GBB 066 T-M05

SEMITOP 3, HPTP

产品规格

特性
产品变体介绍The SK 30 GBB 066 T-M05 is a 600 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
产品变体简要介绍Module + High Performance Thermal Paste (HPTP)
产品状态In Production
产品线SEMITOP
典型应用Switching (not for linear use)InverterSwitched mode power suppliesUPS
原产地Italy
变体HPTP
外壳SEMITOP 3
尺寸55x31x12
技术IGBT
拓扑H-Bridge
特性Compact designOne scre mountingHeat transfer and isolation trough direct copper bonded aluminium oxide ceramic (DCB)Trench IGBT technologyCAL HD technology FWDIntegrated NTC temperature sensor
电压600 V
电流30 A
芯片技术IGBT 3 (Trench)

一般规格

特性
毛重0.039 千克
净重0.03 千克
Proposition 65Cancer and Reproductive Harm