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27892075VM05

SEMiX303GB17E4s-M05

SEMiX 3s, HPTP

产品规格

特性
产品状态In Production
原产地Slovakia
电流300 A
电压1700 V
拓扑Half-Bridge
产品线SEMiX
外壳SEMiX 3s
尺寸150x64x17
技术IGBT
芯片技术IGBT 4 (Trench)
特性Homogeneous SiTrench = Trenchgate technologyV<sub>CE(sat)</sub> with positive temperature coefficientHigh short circuit capabilityUL recognized, file no. E63532
典型应用AC inverter drivesUPSElectronic Welding
变体HPTP

一般规格

特性
毛重0.349 千克
净重0.289 千克

Variant information

特性
Variants<a href="/products/p/semix303gb17e4s-m04-27892075vm04">SEMiX303GB17E4s-M04</a><a href="/products/p/semix303gb17e4s-m05-27892075vm05">SEMiX303GB17E4s-M05</a><a href="/products/p/semix303gb17e4s-m06-27892075vm06">SEMiX303GB17E4s-M06</a><a href="/products/p/semix303gb17e4s-m07-27892075vm07">SEMiX303GB17E4s-M07</a>
产品变体介绍The SEMiX303GB17E4s-M05 is a 1700 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
产品变体简要介绍Module + High Performance Thermal Paste (HPTP)