Semikron Danfoss logo

27892120VM05

SEMiX302GAL17E4s-M05

SEMiX 2s, HPTP

产品规格

特性
产品状态In Production
原产地Slovakia
电流300 A
电压1700 V
拓扑Chopper/Booster
产品线SEMiX
外壳SEMiX 2s
尺寸117x64x17
技术IGBT
芯片技术IGBT 4 (Trench)
特性Homogeneous SiTrench = Trenchgate technologyV<sub>CE(sat)</sub> with positive temperature coefficientHigh short circuit capabilityUL recognized, file no. E63532
典型应用AC inverter drivesUPSElectronic Welding
变体HPTP

一般规格

特性
毛重0.279 千克
净重0.24 千克

Variant information

特性
Variants<a href="/products/p/semix302gal17e4s-m04-27892120vm04">SEMiX302GAL17E4s-M04</a><a href="/products/p/semix302gal17e4s-m05-27892120vm05">SEMiX302GAL17E4s-M05</a><a href="/products/p/semix302gal17e4s-m06-27892120vm06">SEMiX302GAL17E4s-M06</a>
产品变体介绍The SEMiX302GAL17E4s-M05 is a 1700 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
产品变体简要介绍Module + High Performance Thermal Paste (HPTP)