Product specifications
Characteristic | Value |
|---|---|
| Case | SEMITRANS 3 |
| Chip Technology | High Performance Thermal Paste |
| Features | • New high performance thermal paste • Superior heat dissipation • Inhomogeneous honeycomb structure • Optimized thickness of thermal paste layer • High process reliability due to automated screen printing process |
| Housing | SEMITRANS 3 |
| Part Number | 12281056 |
| Product Line | Thermal Interface Material |
| Product Status | In production |
| Product Type | TP(HPTP)SEMITRANS3 |
| Weight in mg | 490 mg |