Semikron Danfoss logo

25231170M15

SKiiP 38AC12T7V1-M15

MiniSKiiP II 3, Slim lid and HPTP

製品仕様

特徴
製品の状態In Production New
原産国ChinaGermany
電流 (A)100 A
電圧 (V)1200 V
トポロジーSixpack
製品ラインMiniSKiiP
ハウジングMiniSKiiP II 3
寸法82x59x16
技術IGBT
チップ技術IGBT T7
特徴1200V Generation 7 IGBTs (T7)Robust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532
Variants<a href="/products/p/skiip-38ac12t7v1-m01-25231170m01">SKiiP 38AC12T7V1-M01</a><a href="/products/p/skiip-38ac12t7v1-m05-25231170m05">SKiiP 38AC12T7V1-M05</a><a href="/products/p/skiip-38ac12t7v1-m15-25231170m15">SKiiP 38AC12T7V1-M15</a><a href="/products/p/skiip-38ac12t7v1-m20-25231170m20">SKiiP 38AC12T7V1-M20</a><a href="/products/p/skiip-38ac12t7v1-m25-25231170m25">SKiiP 38AC12T7V1-M25</a>
バリアントSlim lid and HPTP
分類の簡単な説明Module + Slim Pressure Lid + High Performance Thermal Paste (HPTP)
分類の説明The SKiiP 38AC12T7V1-M15 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.

一般仕様

特徴
総重量0.1 Kilogram
正味重量0.082 Kilogram
Proposition 65Cancer and Reproductive Harm