Semikron Danfoss logo

25233350M15

SKiiP 24NAB12RAV1-M15

MiniSKiiP II 2, Slim lid and HPTP

製品仕様

特徴
製品の状態In Production
原産国ChinaSlovakiaGermany
電流 (A)35 A
電圧 (V)1200 V
トポロジーCIB
製品ラインMiniSKiiP
ハウジングMiniSKiiP II 2
寸法59x52x16
技術IGBT
チップ技術RGA
特徴1200V RGA IGBTRobust and soft switching freewheeling diodes in CAL technologyNew SKR PEP diode technology for enhanced power and environmental robustnessHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

一般仕様

特徴
総重量0.06 Kilogram
正味重量0.055 Kilogram

Variant information

特徴
Variants<a href="/ja-jp/products/p/skiip-24nab12rav1-m01-25233350m01">SKiiP 24NAB12RAV1-M01</a><a href="/ja-jp/products/p/skiip-24nab12rav1-m10-25233350m10">SKiiP 24NAB12RAV1-M10</a><a href="/ja-jp/products/p/skiip-24nab12rav1-m15-25233350m15">SKiiP 24NAB12RAV1-M15</a><a href="/ja-jp/products/p/skiip-24nab12rav1-m20-25233350m20">SKiiP 24NAB12RAV1-M20</a><a href="/ja-jp/products/p/skiip-24nab12rav1-m25-25233350m25">SKiiP 24NAB12RAV1-M25</a><a href="/ja-jp/products/p/skiip-24nab12rav1-m05-25233350m05">SKiiP 24NAB12RAV1-M05</a>
バリアントSlim lid and HPTP
分類の簡単な説明Module + Slim Pressure Lid + High Performance Thermal Paste (HPTP)
分類の説明The SKiiP 24NAB12RAV1-M15 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.