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25230830M15

SKiiP 11HEB066V1-M15

MiniSKiiP II 1, Slim lid and HPTP

製品仕様

特徴
TypeMiniSKiiP II 1
チップ技術IGBT 3 (Trench)
トポロジーCIB
ハウジングMiniSKiiP II 1
バリアントSlim lid and HPTP
分類の簡単な説明Module + Slim Pressure Lid + High Performance Thermal Paste (HPTP)
分類の説明The SKiiP 11HEB066V1-M15 is a 600 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
原産国Germany
寸法42x40x16
技術IGBT
特徴Trench IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532
製品の状態In Production
製品ラインMiniSKiiP
電圧 (V)600 V
電流 (A)15 A

一般仕様

特徴
総重量0.04 Kilogram
正味重量0.03 Kilogram
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