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Semikron Danfoss Standard Photo MiniSKiiP II 0

25232360M15

SKiiP 03NEB066V3-M15

MiniSKiiP II 0, Slim lid and HPTP

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製品仕様

特徴
値
チップ技術IGBT 3 (Trench)
トポロジーCIB
ハウジングMiniSKiiP II 0
バリアントSlim lid and HPTP
代表的なアプリケーションInverter up to 5,6 kVATypical motor power 3,0 kW
分類の簡単な説明Module + Slim Pressure Lid + High Performance Thermal Paste (HPTP)
分類の説明The SKiiP 03NEB066V3-M15 is a 600 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
原産国Germany
寸法34x31x16
技術IGBT
特徴Trench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532
製品の状態In Production
製品ラインMiniSKiiP
電圧 (V)600 V
電流 (A)15 A

一般仕様

特徴
値
総重量0.023 Kilogram
正味重量0.02 Kilogram
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