Semikron Danfoss logo

25232540M11

SKiiP 03NAC12T4V1-M11

MiniSKiiP II 0, Slim lid and Wacker P12

製品仕様

特徴
TypeMiniSKiiP II 0
チップ技術IGBT 4 (Trench)
トポロジーCI
ハウジングMiniSKiiP II 0
バリアントSlim lid and Wacker P12
分類の簡単な説明Module + Slim Pressure Lid + Thermal Paste Wacker P12
分類の説明The SKiiP 03NAC12T4V1-M11 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied Wacker P12 (λ=0.8 W/mK). Wacker P12 is a standard silicone-based thermal paste which has been adjusted to the respective module in terms of layer thickness.
原産国Germany
寸法34x31x16
技術IGBT
特徴Trench 4 IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532
製品の状態In Production
製品ラインMiniSKiiP
電圧 (V)1200 V
電流 (A)8 A

一般仕様

特徴
総重量0.023 Kilogram
正味重量0.02 Kilogram
Proposition 65Cancer and Reproductive Harm