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24921130VM05

SK50DGDL066ETE2-M05

SEMITOP E2, HPTP

製品仕様

特徴
製品の状態Sample Status
原産国Italy
電流 (A)50 A
電圧 (V)600 V
トポロジーCIB
製品ラインSEMITOP
ハウジングSEMITOP E2
寸法63x57x12
技術IGBT
チップ技術IGBT 3 (Trench)
特徴Optimized design for superior thermal performanceLow inductive designPress-Fit contact technology600V Trench IGBT3 (066)Robust and soft switching CAL HD diode technologyIntegrated NTC temperature sensorUL recognized file no. E 63 532
代表的なアプリケーションMotor drivesAir conditioningAuxiliary Inverters

一般仕様

特徴
総重量0.055 Kilogram
正味重量0.035 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

特徴
Variants<a href="/ja-jp/products/p/sk50dgdl066ete2-m05-24921130vm05">SK50DGDL066ETE2-M05</a><a href="/ja-jp/products/p/sk50dgdl066ete2-m07-24921130vm07">SK50DGDL066ETE2-M07</a><a href="/ja-jp/products/p/sk50dgdl066ete2-24921130">SK50DGDL066ETE2</a>
バリアントHPTP
分類の簡単な説明Module + High Performance Thermal Paste (HPTP)
分類の説明The SK50DGDL066ETE2-M05 is a 600 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.