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24922950VM05

SK25DGDL12T7ETE1s-M05

SEMITOP E1 Solder, HPTP

製品仕様

特徴
製品の状態In Production New
原産国Italy
電流 (A)25 A
電圧 (V)1200 V
トポロジーCIB
製品ラインSEMITOP
ハウジングSEMITOP E1 Solder
寸法63x34x12
技術IGBT
チップ技術IGBT T7
特徴Optimized design for superior thermal performanceLow inductive designSolder contact technology1200V Generation 7 IGBT (T7)Robust and soft switching CAL4F diode technologyPEP rectifier diode technology for enhanced power and environmental robustnessIntegrated NTC temperature sensorUL recognized file no. E 63 532
代表的なアプリケーションMotor drivesAir conditioningAuxiliary Inverters

一般仕様

特徴
総重量0.022 Kilogram
正味重量0.022 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

特徴
Variants<a href="/products/p/sk25dgdl12t7ete1s-m05-24922950vm05">SK25DGDL12T7ETE1s-M05</a><a href="/products/p/sk25dgdl12t7ete1s-m07-24922950vm07">SK25DGDL12T7ETE1s-M07</a>
バリアントHPTP
分類の簡単な説明Module + High Performance Thermal Paste (HPTP)
分類の説明The SK25DGDL12T7ETE1s-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.