Semikron Danfoss logo

24920840VM05

SK200TMLI12F4TE2-M05

SEMITOP E2, HPTP

製品仕様

特徴
チップ技術IGBT 4 Fast (Trench)
トポロジー3-Level
ハウジングSEMITOP E2
バリアントHPTP
代表的なアプリケーションUPSSolar
分類の簡単な説明Module + High Performance Thermal Paste (HPTP)
分類の説明The SK200TMLI12F4TE2-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
原産国Italy
寸法63x57x12
技術IGBT
特徴Optimized design for superior thermal performanceLow inductive designPress-Fit contact technology1200V Trench IGBT4 Fast (F4)650V Trench IGBT3 (E3)Robust and soft switching CAL4F diode technologyIntegrated NTC temperature sensorUL recognized file no. E 63 532
製品の状態In Production
製品ラインSEMITOP
電圧 (V)1200 V
電流 (A)200 A

一般仕様

特徴
総重量0.055 Kilogram
正味重量0.035 Kilogram
Proposition 65Cancer and Reproductive Harm