Semikron Danfoss logo

24920071VM05

SK150MLI07F3TD1p-M05

SEMITOP 4 Press-Fit, HPTP

製品仕様

特徴
製品の状態In Production
原産国Italy
電流 (A)150 A
電圧 (V)650 V
トポロジー3-Level
製品ラインSEMITOP
ハウジングSEMITOP 4 Press-Fit
寸法61x55x12
技術IGBT
チップ技術IGBT 3 (Trench)
特徴One screw mounting moduleSolder free mounting with Press-Fit terminalsFully compatible with other SEMITOP<sup>®</sup> Press-Fit typesImproved thermal performances by aluminium oxide substrate650V Trench IGBT technologyCAL4F technology FWDRapid switching clamping diode technologyIntegrated NTC temperature sensorUL recognized, file no. E 63 532
代表的なアプリケーションUPSSolar

一般仕様

特徴
総重量0.074 Kilogram
正味重量0.06 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

特徴
Variants<a href="/products/p/sk150mli07f3td1p-m05-24920071vm05">SK150MLI07F3TD1p-M05</a>
バリアントHPTP
分類の簡単な説明Module + High Performance Thermal Paste (HPTP)
分類の説明The SK150MLI07F3TD1p-M05 is a 650 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.