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24923050VM05

SK10DGDL12T7ETE1s-M05

SEMITOP E1 Solder, HPTP

製品仕様

特徴
チップ技術IGBT T7
トポロジーCIB
ハウジングSEMITOP E1 Solder
バリアントHPTP
代表的なアプリケーションMotor drivesAir conditioningAuxiliary Inverters
分類の簡単な説明Module + High Performance Thermal Paste (HPTP)
分類の説明The SK10DGDL12T7ETE1s-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
原産国Italy
寸法63x34x12
技術IGBT
特徴Optimized design for superior thermal performanceLow inductive designSolder contact technology1200V Generation 7 IGBT (T7)Robust and soft switching CAL4F diode technologyPEP rectifier diode technology for enhanced power and environmental robustnessIntegrated NTC temperature sensorUL recognized file no. E 63 532
製品の状態In Production New
製品ラインSEMITOP
電圧 (V)1200 V
電流 (A)10 A

一般仕様

特徴
総重量0.022 Kilogram
正味重量0.022 Kilogram
Proposition 65Cancer and Reproductive Harm