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24920390VM05

SK 75 GHL 07F3TD1-M05

SEMITOP 3, HPTP

製品仕様

特徴
チップ技術IGBT 3 (Trench)
トポロジーH-Bridge
ハウジングSEMITOP 3
バリアントHPTP
代表的なアプリケーションInverterWeldingUPS
分類の簡単な説明Module + High Performance Thermal Paste (HPTP)
分類の説明The SK 75 GHL 07F3TD1-M05 is a 650 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
原産国Italy
寸法55x31x12
技術IGBT
特徴Compact designOne screw mounting moduleOptimum heat transfer and insulation through direct copper bonding aluminum oxide ceramic (DBC)650V Trench3 Fast IGBT technology650V Rapid switching diodeIntegrated NTC temperature sensorUL recognized, file no. E 63 532
製品の状態In Production New
製品ラインSEMITOP
電圧 (V)650 V
電流 (A)75 A

一般仕様

特徴
総重量0.039 Kilogram
正味重量0.03 Kilogram
Proposition 65Cancer and Reproductive Harm