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24914750VM05

SK 50 GBB 066 T-M05

SEMITOP 3, HPTP

製品仕様

特徴
製品の状態In Production
原産国Italy
電流 (A)50 A
電圧 (V)600 V
トポロジーH-Bridge
製品ラインSEMITOP
ハウジングSEMITOP 3
寸法55x31x12
技術IGBT
チップ技術IGBT 3 (Trench)
特徴Compact designOne scre mountingHeat transfer and isolation trough direct copper bonded aluminium oxide ceramic (DCB)Trench IGBT technologyCAL HD technology FWDIntegrated NTC temperature sensor
代表的なアプリケーションSwitching (not for linear use)InverterSwitched mode power suppliesUPS

一般仕様

特徴
総重量0.039 Kilogram
正味重量0.03 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

特徴
Variants<a href="/products/p/sk-50-gbb-066-t-m05-24914750vm05">SK 50 GBB 066 T-M05</a>
バリアントHPTP
分類の簡単な説明Module + High Performance Thermal Paste (HPTP)
分類の説明The SK 50 GBB 066 T-M05 is a 600 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.