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27892075VM05

SEMiX303GB17E4s-M05

SEMiX 3s, HPTP

製品仕様

特徴
製品の状態In Production
原産国Slovakia
電流 (A)300 A
電圧 (V)1700 V
トポロジーHalf-Bridge
製品ラインSEMiX
ハウジングSEMiX 3s
寸法150x64x17
技術IGBT
チップ技術IGBT 4 (Trench)
特徴Homogeneous SiTrench = Trenchgate technologyV<sub>CE(sat)</sub> with positive temperature coefficientHigh short circuit capabilityUL recognized, file no. E63532
代表的なアプリケーションAC inverter drivesUPSElectronic Welding

一般仕様

特徴
総重量0.349 Kilogram
正味重量0.289 Kilogram

Variant information

特徴
Variants<a href="/products/p/semix303gb17e4s-m04-27892075vm04">SEMiX303GB17E4s-M04</a><a href="/products/p/semix303gb17e4s-m05-27892075vm05">SEMiX303GB17E4s-M05</a><a href="/products/p/semix303gb17e4s-m06-27892075vm06">SEMiX303GB17E4s-M06</a><a href="/products/p/semix303gb17e4s-m07-27892075vm07">SEMiX303GB17E4s-M07</a>
バリアントHPTP
分類の簡単な説明Module + High Performance Thermal Paste (HPTP)
分類の説明The SEMiX303GB17E4s-M05 is a 1700 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.