Fast and Easy Assembly of Module and PCB
Press-Fit at a Glance
PRESS-FIT Technology uses special pins to establish an electrical connection between power module and printed circuit board. The basic principle is a specially constructed pin is forced into a smaller diameter hole in the PCB. Through the press-in process, the pin undergoes plastic deformation, ensuring a gas-tight connection with low ohmic resistance. Though this connection is different from a spring-type contact, only small insertion forces are necessary, and high retention forces result.
PRESS-FIT Technology ensures easy and fast mounting of the module and PCB, reducing assembly time and cost by eliminating the solder process. When the PCB (e.g. driver board) is mounted, the electrical contacts are established in one assembly step. Simple maintenance is also possible with these solder-free pressure contacts, as board and module can be separated easily. In the case of a failure, one of those parts can be used again and has not to be disposed. Though PRESS-FIT Technology is innovative, the printed circuit board has not to fulfil any remarkable requirements.
Press-Fit Key Features
- Unique pin geometry
- Qualified according to corresponding IEC standards
- Reliable connection
- Small insertion force, high retention force
PRESS-FIT Technology contacts are used both as control connections as well as for power connections within the context of today's rapidly increasing current-carrying capacity of printed circuit boards. Modules in the medium power range only have them for auxiliary signals, while low power modules also use several press-fit pins in parallel for the power connections. The technology is also well-established in automotive applications where a reliable connection is required for high-volume production.
Press-Fit Product Range
Already two of the SEMIKRON product lines make use of the press-fit technology: SEMiX & SEMITOP. Different housing sizes within each line are equipped with eye-of-the-needle pins. For SEMITOP it is sizes 2, 3 and 4, while SEMiX has them in the competitor compatible packages 3 and 5.