Double Sided Sintering (DSS)

Goodbye Bond Wire

Flex layers replace wire bonding

In 2011 SEMIKRON presented the SKiN module, the first product using the Double Sided Sintering Technology (DSS). It comprises the consistent application of the sintering technology on all material combinations significant to power cycling in a power module: the chip die attach and the wire bond connections are replaced by sinter layers.

The SEMIKRON Sinter Technology utilizes a fine silver powder at a temperature of around 250°C under high pressure, sintered to a silver layer of very low porosity. It connects chip, DBC surface and flex layer to an extremely long-term, reliable material stack, benefitting from the melting point of silver at 962°C.

The flex layer takes over the function of the bond wires and connects the chip via a much bigger area connection. It allows for an increase of the surge current capability by about 25%. Compared to conventional power modules the additional performance allows an approximate doubling of the current density on system level.

Double Sided Sintering – Key Features

  • Highly reliable sinter connections replacing solder and wire bonding
  • High power density
  • High power cycling reliability
  • 25% higher surge currents thanks to big contact area of the die interconnect