Multiple SourcingSupply Chain Safety
Industry Standard Packages
Ensuring supply chain safety for the customer is one of the main targets for Semikron Danfoss. The development and successful introduction of industry standard packages reflects that strategy. With SEMIPACK, MiniSKiiP, SEMITOP E1/E2, SEMITRANS Classic, SEMiX 6 Press-Fit, SEMiX 5, SEMiX 3 Press-Fit, SEMITRANS 10 and SEMITRANS 20, nine different power module packages are available. These modules are fully pin-compatible with the market standards.
Multiple Source Key Features
- Highest supply chain safety through the complete range of industry standard packages
- Several IGBT sources and free-wheeling diode chips are available in all voltage classes
Exceeding the Standard...
- ...by smart integration of functionality without increasing package size
- ...thanks to optimization of the internal power module design
Supply chain safety and multiple sourcing not only applies to the package, but to individual components as well. Therefore, Semikron Danfoss has multiple chip sources for IGBTs and free-wheeling diodes.
This includes long-term partnerships with established suppliers for the latest Generation 7 IGBTs, as well as continuous efforts to establish new sources to secure the supply chain.
For the corresponding free-wheeling diodes, further manufacturers are available in addition to the reliable Semikron Danfoss CAL diodes.
Exceeding the Standard
Semikron Danfoss pays special attention to further increasing the performance of the standard packages. The SEMiX 3 Press-Fit is available with and integrated current shunt, lowering the system cost by integrating the current measurement into the power module with no additional space. For the standard SEMiX 3 Press-Fit, a plug-and-play driver is available to ensure fastest time-to-market.
SEMiX 5 is optimised for heat spreading inside the module and thus lower thermal resistance. The stray inductance is the lowest on the market, allowing the switching of higher output currents with the same voltage overshoot on chip level.
Our SEMITOP E1/E2 outperforms other suppliers’ compatible packages thanks to a unique housing construction. In combination with the pre-applied High Performance Thermal Paste (HPTP), the thermal resistance can be reduced by up to 50% in the same nominal IGBT current rating. This converts into higher output power or lower chip temperature and thus longer lifetime.