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22894270VM05

SKM800GM12M7-M05

SEMITRANS 3, HPTP

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)106x62x31
Chip TechnologieIGBT M7
EigenschaftenV<sub>CE(sat)</sub> with positive temperature coefficientFast and soft switching inverse CAL7 diodesHigh overload capabilityLow loss high density IGBT´sLarge clearance (10 mm) and creepage distances (20 mm)Insulated copper baseplate using DBC Technology (Direct Bonded Copper)UL recognized, file no. E63532
GehäuseSEMITRANS 3
HerkunftslandSlovakia
ProduktlinieSEMITRANS
ProduktstatusIn Production New
Spannung1200 V
Stromstärke (A)800 A
TechnologieIGBT
TopologieAC Switch
Typische AnwendungsgebieteMatrix InverterBidirectional switch
VarianteHPTP
Varianten BeschreibungThe SKM800GM12M7-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + High Performance Thermal Paste (HPTP)

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.32 Kilogramm
Nettogewicht0.31 Kilogramm