23918900VM05
SKiM601MLI07E4-M05
SKiM 4, HPTP
23918900VM05
Produktdaten
Eigenschaften | Wert |
|---|---|
| Abmessungen (LxBxH) | 123x107x35 |
| Chip Technologie | IGBT 3 (Trench) |
| Eigenschaften | IGBT 4 Trench Gate TechnologySolder technologyV<sub>CE(sat)</sub> with positive temperature coefficientLow inductance caseIsolated by Al<sub>2</sub>O<sub>3</sub> DCB (Direct Copper Bonded) ceramic substratePressure contact technology for thermal contactsSpring contact system to attach driver PCB to the control terminalsHigh short circuit capability, self limiting to 6 x I<sub>C</sub>Integrated temperature sensor |
| Gehäuse | SKiM 4 |
| Herkunftsland | Italy |
| Produktlinie | SKiM 4/5 |
| Produktstatus | In Production |
| Spannung | 650 V |
| Stromstärke (A) | 600 A |
| Technologie | IGBT |
| Topologie | 3-Level |
| Typische Anwendungsgebiete | UPS3 Level Inverter |
| Variante | HPTP |
| Varianten Beschreibung | The SKiM601MLI07E4-M05 is a 650 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| Varianten Kurzbeschreibung | Module + High Performance Thermal Paste (HPTP) |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.426 Kilogramm |
| Nettogewicht | 0.295 Kilogramm |
| Proposition 65 | Cancer and Reproductive Harm |