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Semikron Danfoss Standard Photo SKiM 4

23918960VM05

SKiM301TMLI12E4B-M05

SKiM 4, HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)123x107x35
Chip TechnologieIGBT 4 (Trench)
EigenschaftenIGBT 4 Trench Gate TechnologySolder technologyV<sub>CE(sat)</sub> with positive temperature coefficientLow inductance caseIsolated by Al<sub>2</sub>O<sub>3</sub> DCB (Direct Copper Bonded) ceramic substratePressure contact technology for thermal contactsSpring contact system to attach driver PCB to the control terminalsHigh short circuit capability, self limiting to 6 x I<sub>C</sub>Integrated temperature sensor
GehäuseSKiM 4
HerkunftslandItaly
ProduktlinieSKiM 4/5
ProduktstatusIn Production
Spannung1200 V
Stromstärke (A)300 A
TechnologieIGBT
Topologie3-Level
TypSKiM 4
Typische AnwendungsgebieteAutomotive inverterHigh reliability AC inverter windHigh reliability AC inverter drives
VarianteHPTP
Varianten BeschreibungThe SKiM301TMLI12E4B-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + High Performance Thermal Paste (HPTP)

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.441 Kilogramm
Nettogewicht0.31 Kilogramm
Proposition 65Cancer and Reproductive Harm