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23916120VM05

SKiM270GD176D-M05

SKiM 5, HPTP

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)178x107x35
Chip TechnologieIGBT 3 (Trench)
EigenschaftenHomogenous SiTrench = Trenchgate TechnologyLow inductance caseIsolated by Al2O3 DCB (Direct Copper Bonded) ceramic platePressure contact technology for PCB mountingVCEsat with positive temperature coefficientHigh short circuit capability, self limiting to 6x ICVf value is specified on chip levelIntegrated temperature sensor
GehäuseSKiM 5
HerkunftslandItaly
ProduktlinieSKiM 4/5
ProduktstatusIn Production
Spannung1700 V
Stromstärke (A)300 A
TechnologieIGBT
TopologieSixpack
Typische AnwendungsgebieteAC inverter drives mains 575 - 750 V ACpublic transport (auxiliary syst.)
VarianteHPTP
Varianten BeschreibungThe SKiM270GD176D-M05 is a 1700 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + High Performance Thermal Paste (HPTP)

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.556 Kilogramm
Nettogewicht0.46 Kilogramm
Proposition 65Cancer and Reproductive Harm