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25241220M21

SKiiP39GB12VV1-M21

MiniSKiiP II 3, Standard lid and Wacker P12

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)82x59x16
Chip TechnologieV-IGBT
EigenschaftenRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532
GehäuseMiniSKiiP II 3
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production New
Spannung1200 V
Stromstärke (A)400 A
TechnologieIGBT
TopologieHalf-Bridge
TypMiniSKiiP II 3
VarianteStandard lid and Wacker P12
Varianten BeschreibungThe SKiiP39GB12VV1-M21 is a 1200 V IGBT module and comes with a standard 6.5mm height lid and pre-applied silicone-based thermal paste Wacker P12 (λ=0.8 W/mK).
Varianten KurzbeschreibungModule + Standard Pressure Lid + Thermal Paste Wacker P12

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.098 Kilogramm
Nettogewicht0.08 Kilogramm
Proposition 65Cancer and Reproductive Harm