Semikron Danfoss logo
Semikron Danfoss Standard Photo MiniSKiiP II 3

25230510M15

SKiiP 39MLI12T4V1-M15

MiniSKiiP II 3, Slim lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)82x59x16
Chip TechnologieIGBT 4 (Trench)
EigenschaftenTrench 4 IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532NTC T-Sensor
GehäuseMiniSKiiP II 3
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production New
Spannung1200 V
Stromstärke (A)150 A
TechnologieIGBT
Topologie3-Level
TypMiniSKiiP II 3
VarianteSlim lid and HPTP
Varianten BeschreibungThe SKiiP 39MLI12T4V1-M15 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Varianten KurzbeschreibungModule + Slim Pressure Lid + High Performance Thermal Paste (HPTP)

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.1 Kilogramm
Nettogewicht0.082 Kilogramm
Proposition 65Cancer and Reproductive Harm