Semikron Danfoss logo
Semikron Danfoss Standard Photo MiniSKiiP II 3

25241222M25

SKiiP 39GB12T7V1-M25

MiniSKiiP II 3, Standard lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandGermany
Stromstärke (A)400 A
Spannung1200 V
TopologieHalf-Bridge
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 3
Abmessungen (LxBxH)82x59x16
TechnologieIGBT
Chip TechnologieIGBT T7
Eigenschaften1200V Generation 7 IGBTs (T7)Robust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532NTC T-Sensor

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.094 Kilogramm
Nettogewicht0.076 Kilogramm
Proposition 65Cancer and Reproductive Harm

Variant information

Eigenschaften
Wert
VarianteStandard lid and HPTP
Varianten BeschreibungThe SKiiP 39GB12T7V1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Varianten KurzbeschreibungModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/de-de/products/p/skiip-39gb12t7v1-m20-25241222m20">SKiiP 39GB12T7V1-M20</a><a href="/de-de/products/p/skiip-39gb12t7v1-m01-25241222m01">SKiiP 39GB12T7V1-M01</a><a href="/de-de/products/p/skiip-39gb12t7v1-m15-25241222m15">SKiiP 39GB12T7V1-M15</a><a href="/de-de/products/p/skiip-39gb12t7v1-m25-25241222m25">SKiiP 39GB12T7V1-M25</a>