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Semikron Danfoss Standard Photo MiniSKiiP II 3 GB

25241221M10

SKiiP 39GB12E4V1-M10

MiniSKiiP II 3, Slim lid M10

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)82x59x16
Chip TechnologieIGBT 4 (Trench)
EigenschaftenTrench 4 IGBT´sRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized file no. E63532
GehäuseMiniSKiiP II 3
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production New
Spannung1200 V
Stromstärke (A)400 A
TechnologieIGBT
TopologieHalf-Bridge
TypMiniSKiiP II 3
VarianteSlim lid M10
Varianten BeschreibungThe SKiiP 39GB12E4V1-M10 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid for compact layouts.
Varianten KurzbeschreibungModule + Slim Pressure Lid

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.094 Kilogramm
Nettogewicht0.076 Kilogramm
Proposition 65Cancer and Reproductive Harm