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Semikron Danfoss Standard Photo MiniSKiiP II 3

25231180M15

SKiiP 39AHB16V3-M15

MiniSKiiP II 3, Slim lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)82x59x16
EigenschaftenFast Trench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532
GehäuseMiniSKiiP II 3
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production New
Spannung1600 V
Stoßstrom (A)1250 A
Stromstärke (A)128 A
TechnologieBridge
TopologieRectifier
TypMiniSKiiP II 3
Typische AnwendungsgebieteInput bridge for inverter up to 45 kVA
VarianteSlim lid and HPTP
Varianten BeschreibungThe SKiiP 39AHB16V3-M15 is a 1600 V Bridge module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Varianten KurzbeschreibungModule + Slim Pressure Lid + High Performance Thermal Paste (HPTP)

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.1 Kilogramm
Nettogewicht0.082 Kilogramm
Proposition 65Cancer and Reproductive Harm