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Semikron Danfoss Standard Photo MiniSKiiP II 3

25233300M15

SKiiP 38NAB12RAV1-M15

MiniSKiiP II 3, Slim lid and HPTP

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
ProduktstatusIn Production New
HerkunftslandChinaSlovakiaGermany
Stromstärke (A)100 A
Spannung1200 V
TopologieCIB
ProduktlinieMiniSKiiP
GehäuseMiniSKiiP II 3
Abmessungen (LxBxH)82x59x16
TechnologieIGBT
Chip TechnologieRGA
Eigenschaften1200V RGA IGBTRobust and soft switching freewheeling diodes in CAL technologyNew SKR PEP diode technology for enhanced power and environmental robustnessHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.1 Kilogramm
Nettogewicht0.082 Kilogramm

Variant information

Eigenschaften
Wert
VarianteSlim lid and HPTP
Varianten BeschreibungThe SKiiP 38NAB12RAV1-M15 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Varianten KurzbeschreibungModule + Slim Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/de-de/products/p/skiip-38nab12rav1-m01-25233300m01">SKiiP 38NAB12RAV1-M01</a><a href="/de-de/products/p/skiip-38nab12rav1-m15-25233300m15">SKiiP 38NAB12RAV1-M15</a><a href="/de-de/products/p/skiip-38nab12rav1-m20-25233300m20">SKiiP 38NAB12RAV1-M20</a><a href="/de-de/products/p/skiip-38nab12rav1-m25-25233300m25">SKiiP 38NAB12RAV1-M25</a>