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Semikron Danfoss Standard Photo MiniSKiiP II 3

25230650M01

SKiiP 38NAB066V1-M01

MiniSKiiP II 3, Wacker P12

*Konto erforderlich

Produktdaten

Eigenschaften
Wert
Abmessungen (LxBxH)82x59x16
Chip TechnologieIGBT 3 (Trench)
EigenschaftenTrench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532
GehäuseMiniSKiiP II 3
HerkunftslandGermany
ProduktlinieMiniSKiiP
ProduktstatusIn Production
Spannung600 V
Stromstärke (A)100 A
TechnologieIGBT
TopologieCIB
TypMiniSKiiP II 3
Typische AnwendungsgebieteInverter up to 22 kVATypical motor power 11 kW
VarianteWacker P12
Varianten BeschreibungThe SKiiP 38NAB066V1-M01 is a 600 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation.
Varianten KurzbeschreibungModule + Thermal Paste Wacker P12

Allgemeine Spezifikationen

Eigenschaften
Wert
Bruttogewicht0.1 Kilogramm
Nettogewicht0.082 Kilogramm
Proposition 65Cancer and Reproductive Harm