25241719M11
SKiiP 38GB17E4V1-M11
MiniSKiiP II 3, Slim lid and Wacker P12
25241719M11
Produktdaten
Eigenschaften | Wert |
|---|---|
| Abmessungen (LxBxH) | 82x59x16 |
| Chip Technologie | IGBT 3 (Trench) |
| Eigenschaften | Trench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532NTC T-Sensor |
| Gehäuse | MiniSKiiP II 3 |
| Herkunftsland | Germany |
| Produktlinie | MiniSKiiP |
| Produktstatus | In Production New |
| Spannung | 1700 V |
| Stromstärke (A) | 300 A |
| Technologie | IGBT |
| Topologie | Half-Bridge |
| Typ | MiniSKiiP II 3 |
| Variante | Slim lid and Wacker P12 |
| Varianten Beschreibung | The SKiiP 38GB17E4V1-M11 is a 1700 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation. |
| Varianten Kurzbeschreibung | Module + Slim Pressure Lid + Thermal Paste Wacker P12 |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.1 Kilogramm |
| Nettogewicht | 0.082 Kilogramm |
| Proposition 65 | Cancer and Reproductive Harm |