25240719M21
SKiiP 38GB07E3V1-M21
MiniSKiiP II 3, Standard lid and Wacker P12
25240719M21
Produktdaten
Eigenschaften | Wert |
|---|---|
| Abmessungen (LxBxH) | 82x59x16 |
| Chip Technologie | IGBT 3 (Trench) |
| Eigenschaften | 650V Trench IGBTsRobust and soft diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532NTC T-Sensor |
| Gehäuse | MiniSKiiP II 3 |
| Herkunftsland | Germany |
| Produktlinie | MiniSKiiP |
| Produktstatus | In Production New |
| Spannung | 650 V |
| Stromstärke (A) | 300 A |
| Technologie | IGBT |
| Topologie | Half-Bridge |
| Typ | MiniSKiiP II 3 |
| Variante | Standard lid and Wacker P12 |
| Varianten Beschreibung | The SKiiP 38GB07E3V1-M21 is a 650 V IGBT module and comes with a standard 6.5mm height lid and pre-applied silicone-based thermal paste Wacker P12 (λ=0.8 W/mK). |
| Varianten Kurzbeschreibung | Module + Standard Pressure Lid + Thermal Paste Wacker P12 |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 0.1 Kilogramm |
| Nettogewicht | 0.082 Kilogramm |
| Proposition 65 | Cancer and Reproductive Harm |